Dimension: 156 mm x 156 mm ± 0.5 mm

Wafer Thickness: 200 μm ± 20 μm.

Front side (－):Blue Antireflective Coating (silicon nitride), Texturized Surface (acid), Three 1.5mm Bus Bars (silver)

Back side (＋): Full Back-Surface Field (aluminum), 2.7 mm wide soldering Pads (silver/ aluminum)