Keo tản nhiệt TG-NSP25 

 

  • TG-NSP25 is an ultra conformable silicone-free putty type gap filler. It is designed for when heat transfer is needed between delicate components where the pressure must be minimised and silicone contamination cannot be tolerated. TG-NSP25 is designed to fill gaps from 0.25 – 8mm with little or no stress generated. The non-silicone formulation will adhere to all surfaces, such as metal housings, ceramic and plastic IC packages and FR4 boards to give a low thermal resistance path for heat transfer. 
  • TG-NSP25 is a silicone-free type spacer with 2.5W/mk
  • Have enough compressibility
  • Very low thermal resistance
  • Best for NorthBridge IC
  • TG-NSP25 is available in 30cc syringes, 6 and 12oz cartridges and 5 gallon pails.

Applications

  • Electronic components: IC、CPU、MOS…
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub…
  • DDR II Module、DVD Applications、Hand-set applications…
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